Biography of Principal - Douglas Pike

Doug is a very experienced semiconductor engineering professional.  He is a veteran of silicon valley and has worked at five major companies during his varied career.  He has 
been a manager at every phase of silicon wafer fabrication engineering and manufacturing and came up through the ranks of process engineering, design engineering, process development and yield enhancement engineering to become Wafer Fab Director.

Experience

His career includes experience with all major silicon process technologies including MEMS, Bipolar, CMOS, BiCMOS, DMOS, IGBT and DI.  
He has been involved in start up companies for MEMS, Power MOSFETs, IGBT's and Optoelectronics.
He has expertise in yield engineering and failure analysis of circuits from MEMS, Bipolar, Bipolar Opto, CMOS, BiCMOS, IGBT and power DMOS.

Education

He received the MSEE and BSEE degrees from Lehigh University in Bethlehem, PA where he studied with Dr Frank Hielscher in Microelectronics.  

Patents

Has 13 patents in areas such as circuit design, process flow and process architecture

Project Summary

      Process Architecture

  • MEMS structure integrated with Bipolar for Medical Applications
  • Optically sensitive ECL process developed to manufacture Optolsolator product line.
  • Optically sensitive HV Bipolar/PMOS process developed to support offline Optolsolator products.
  • Power DMOS process developed to support 100-1200v power DMOS product offering
  • Power IGBT process developed to support 600-1400v power IGBT product offering
  • Power FRED process developed to support 400-1400v power FRED line
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      Process Development

  • Transparent conductive film development, utilized in optical devices as electrical noise shield.
  • Reactive sputtering, noble metal barrier and liftoff technologies developed
  • Photoresist planarization developed and utilized to produce one of the industry's standard DMOS technologies
  • Platinum evaporation or sputtering developed to obtain excellent switching speed for power IGBTs and diodes

      Yield Improvement

  • Arsenic Implant  Annealing to solve junction leakage problem
Mobile: (541) 420-1243
dapike@dapikeengineering.com
https://www.linkedin.com/company/dapike-engineering-inc